Serves as the Functional Test Engineer. The Defense Microelectronics Activity (DMEA) is responsible for all microelectronics technology throughout the Department of Defense. The DOD mission primarily involves sustaining fielded weapons systems (i.e., for aircraft, sea vessels, and land vehicles/equipment), providing technical assistance in the development of new electronic systems, and serving as executive agent for diminishing manufacturing sources. The incumbent will serve as a professional microelectronics Application Specific Integrated Circuit (ASIC) test engineer responsible for product functional verification through circuit level testing and packaged circuit reliability. Key skills in this endeavor include wafer probing, printed circuit board design, complex troubleshooting, and test plan creation, development and implementation.
Electrical Testing: Advantest: Develops digital and mixed signal test programs on the automated test equipment (ATE) Advantest 93000 using provided test libraries and C++. Performs tasks associated with test program development on the 93000, including verification of functional vectors to simulation, timing analysis, and analysis using the software results tools such as wafer mapping. Establishes relationships in software between requirements and capabilities of the 93000 such as known AC and DC characteristics. Addresses missing parameters from test plans such as AC characteristics, DC
characteristics and output vectors. Performs additional tasks associated with test program development on the 93000 including package level ASIC test, first silicon characterization, final electrical test, limited production test, serialized testing. Addresses top level problems typically associated with interfacing additional equipment to the 93000 such as corrupt drivers, loose/bad connections, and other problems that may occur as a result of frequent breakdown and setup. Performs day to day setup and breakdown of the Electroglas 4090u wafer prober for wafer level testing and develops product files to specify die location on ASIC to be tested. Interfaces additional test equipment to the 93000 such as part handlers to achieve testing of a large number of identical parts and a Temptronic thermal tester to achieve specific test goals for functional testing from -55oC to 125oC. Prepares documentation packages including test plans, test reports, and other information per customer requirements. 50%
Reliability Testing: Performs testing specific to military standard 883 method 1015, burn-in testing; method 1005, life testing; method 1010, Temperature Cycle Testing; and method 1004, moisture resistance testing. Conducts tests and analyzes results of reliability testing. Documents tests prior to and upon completion of testing in the form of test plans and test reports. Provides technical solutions to failures that occur as a result of burn-in testing, life testing, temperature cycle testing, and moisture resistance testing. Develops procedures and guidance documentation targeted to appropriate personnel from management to operator level covering a variety of tasks such as running tests to setting up a test environment. Collects, interprets and analyzes data using commercially available software and presents relevant information to interested parties in a meaningful and applicable format to include graphs, curves, thresholds, and other acceptable scientific means of analysis. 20%
PCB Design for Test: The incumbent will design device under test (DUT) printed circuit boards from start to finish using the electronic design automation software package Altium Designer. Creates and modifies schematic designs and PCB layouts, generates manufacturing files for submission to vendor, and consistently interfaces with the vendor resolving any questions. Responsible for Identifying components for schematics and procure parts for final PCB assembly. Creates and modifies manufacturing files as necessary to meet board vendor capabilities. Ensures quality vendor, personal, and coworker schematic level, PCB level and manufacturing level files and finished products. Communicates effectively with other disciplines using typical engineering forms of communication such as block diagrams, system layouts, flow charts, state charts and other abstract representations that can be tailored down into a specific configuration through collaboration. 20%
Electrostatic Discharge (ESD): Performs ESD analysis using testing standards and models that include Human Body Model (HBM), Charged Device Model (CDM), and Transmission- Line Pulse (TLP) on semiconductor devices, to include validation of the waveforms used. Performs testing specific to military standard 883 method 3015 Electrostatic Discharge Sensitivity Classification. Develops test plans, test programs and run cards per customer requirements. Works closely with process integration and design engineers to develop stress matrices for both circuit and device-level characterization. Uses sufficient familiarity with ESD protection elements and semiconductor device physics to support redesign activities. Operates advanced test equipment including the Thermo-Fisher MK1 and electronic measurement equipment such as Agilent oscilloscopes and the Agilent 4156C parametric analyzer. Utilizes Thermo-Fisher’s Scimitar control software to develop test programs for ESD testing and to map multi-site fixture boards to equipment. Uses Microsoft Excels advanced features, such as SPC, and macro development tools, or similar programs to compile and present data. 10%