Staff level engineer working in a team environment will be directly involved with development
and production of electronic packaging methods. Responsibilities will include characterization and qualification of materials and processes for the manufacture of industry leading advanced power component solutions and transitioning and supporting those process in production.
- Will work with enabling technologies such as dry etch, wet etch, electrodeposition, and lithography integrated with PCB and SMT technologies.
- Works with state of the art suppliers and material sets including thermal epoxies, laminates, and thin films.
- Develops cost effective electronics packaging improvements to existing methods and leads efforts in solutions for new products.
- Characterizes materials and processes using analytical techniques. Determines material interactions and impact of thermal, electrical, mechanical, and chemical stresses on product performance, yield, and reliability.
- Writes technical reports and prepares presentations for peer review covering research and development activities, process and materials specifications, and next generation processing methods to supporting technologies that our customers use application such as cloud servers, autonomous vehicles, military and industrial equipment.
- Work independent as well as leads cross-functional development teams.
Critical Skills, Knowledge and Abilities
- Experience working to develop, scale-up, and support new products.
- Demonstrated capability in SPC methods as applied to manufacturing and process improvement.
- Experience working continuous improvement activities and demonstrated use of decision-making and problem-solving tools such as design of experiments (DOE), fault trees, failure mode and effect analysis (PFMEA).
- Ability to be an independent, creative thinker to solve cutting edge technical challenges within the constraints of an overall system design and cost model.
- Excellent written and verbal communication skills.
· BS/MS in Materials, Chemical, Mechanical, Applied Physics or Chemistry.
· Minimum 3-5 years of experience with preferred exposure towards electronics packaging and/or semiconductor based processing. Post graduate research experience in an academic setting will count towards industry experience.
· Experience using design based software systems for product review and development. Examples include Solid Works, Pro Engineer, or Auto CAD.
· Minimum of introductory experience with RF and Microwave plasma cleaning/dry etch processes and vacuum deposition processes a plus
· Familiarity with advanced packaging and processing strategies for system in a package devices (SIP) incorporating high layer count laminate (PCB) and ceramic substrates, ferrites, flip chips, BGA’s, lead-free soldering, MSL, transfer molding and encapsulation, high current interconnects a plus.
· Minimum of introductory printed circuit board fabrication processes and equipment a plus.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability or protected veteran status.
Vicor is an EO employer – M/F/Veteran/Disability