Currently looking for an experienced Electronics Packaging Engineer. Strong packaging design skills, thermal and mechanical FEA analysis experience, and the ability to define process requirements with a team of engineers are required. An MS or Ph.D. in EE or a related technical field is required. MUST be in the U.S. Also, MUST have prior industry experience of at least 3-5 years. Bay Area, CA, relocation, benefits, salaried. Please contact me, and include your current resume, if your skillset matches these requirements. Thanks.
The Photonics Group