PMTS Technology & Development
Location: 1000 River Street, Essex Junction, VT 05452
Position Title: PMTS Technology & Development
Hours: Monday – Friday, 8:00 am to 5:00 pm
Summary of Duties:
Serve as a lead technical resource for package engineering. Prepare quotes in response to the Business Unit (BU) customer request in Advance Packages: FCBGA, fccsp, QFN, Sccsp, wlcsp, 2.5D, mcm. Assemble and lead team to address all package features. Drive solutions to lowest cost that meets customer requirements. Responsibilities will include laminate layer structure and material set, component layout, component selection, lid design and manufacturing process, module stack up, thermal analysis, mechanical analysis, RF design, and qualification plan (test vehicle description, test vehicle and product quantities, stresses, costs, timeline). Discuss package technology solutions (both technical and cost aspect) with customers and GLOBALFOUNDRIES customer interface team. Obtain vendor quotes for product packages: unit cost, NRE, timeline, and special circumstances such as cooperative development. Describe product’s package features: laminate/substrate, interconnect, lid design, thermal performance, components. Describe delivery timeline. Highlight technology challenges and mitigation plans/costs/NRE for any out-of-envelope expenses. Work with vendor to optimize our product based on some or all of the parameters key to the product - minimum cost, minimum risk, rapid delivery. Work on development path to utilize existing GLOBALFOUNDRIES and supplier roadmap whenever possible. Identify and plan package technology path forward with Business Unit and Sales Team.
Position requires a Bachelor’s degree in Chemical Engineering, Industrial Engineering, Electrical Engineering, Materials Engineering or related engineering field plus fifteen (15) years in the job offered or in a Technology & Development related position involving packaging solutions for the semiconductor industry. Alternately, will accept a Master’s degree in Chemical Engineering, Industrial Engineering, Electrical Engineering, Materials Engineering or related engineering field plus thirteen (13) years of experience in the job offered or in a Technology & Development related position involving packaging solutions for the semiconductor industry, or a Ph.D. degree in Chemical Engineering, Industrial Engineering, Electrical Engineering, Materials Engineering or related engineering field plus nine (9) years of experience in the job offered or in a Technology & Development related position involving packaging solutions for the semiconductor industry. Position requires nine (9) years of experience in the following: Technical program management; Working with external customers on development projects; Hands-on experience working on OSAT process in Asia and US or Europe; Advanced Packaging; Generating qualification plan, including test vehicle description, test vehicle, DOE matrix and product quantities, reliability stresses, cost, timeline; Working with vendor quotes for product packages, including: unit cost, NRE, timeline, and special circumstances such as cooperative development; Overall planning including upstream and downstream flow to packaging assembly schedule and technical implications (such as substrate, Fab, and Final test); and Working with a semiconductor foundry. Position requires three (3) years of experience working with both RF or ASICs applications for packaging. Position requires experience with the following: Working with development, NPL, Business Unit, and program management including: Flipchip BGA, FCCSP, WLCSP, or Wirebond packages (both Leadframe and Laminate); Packaging product life cycle from feasibility, customer bid, development, and NPI management, including documentation, multifunction team management at each stage and risk assessments; Generating and reviewing Quality Systems including 8D, Control Plans, FMEA, Problem Solving Methodology, and Statistical Analysis; Working on IFX and automotive programs; Working with advance packages such as PBGA, FCBGA, FCCSP, WLCSP, sccsp and QFN; Customer and conflict management; Assembling and leading a team to address all semiconductor package features; and Discussing package technology with customers and internal customer interface team.
GLOBALFOUNDRIES is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, sexual orientation, gender identity, national origin, disability, or protected Veteran status.